MG Chemicals 4900-18G SAC305 Lead-Free No Clean Solder Pocket Pack, 2-pack
The MG Chemicals SAC305 Lead-Free No Clean Solder Pocket Pack is designed for convenient, high-performance soldering in both professional and DIY electronic applications. This solder wire is made from a SAC305 alloy (96.5% tin, 3% silver, 0.5% copper) and comes in a handy 2-pack for easy portability. The no-clean flux core ensures reliable solder joints without the need for post-soldering cleaning.
Features
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Lead-Free Composition: Complies with RoHS directives, safe for both users and the environment.
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High Performance: SAC305 alloy provides excellent wetting and soldering properties.
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No Clean Flux Core: Leaves minimal residues, eliminating the need for post-soldering cleaning.
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Convenient Packaging: Pocket-sized pack is ideal for field repairs and on-the-go soldering tasks.
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Reliable and Strong Joints: Ensures high-quality, durable connections for electronic components.
Specifications
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Alloy Composition: 96.5% tin, 3% silver, 0.5% copper (SAC305)
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Flux Type: No clean
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Wire Diameter: 0.81 mm (0.032 in)
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Melting Point: 217°C (423°F)
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Volume: 2-pack
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Compliance: RoHS compliant
Example Use Scenario
The MG Chemicals SAC305 Lead-Free No Clean Solder Pocket Pack is perfect for field technicians who need a reliable soldering solution on the go. For instance, when performing repairs on a remote site, the pocket pack allows technicians to quickly and efficiently solder electronic components without needing to carry bulky equipment. The no-clean flux ensures that the job can be completed without requiring additional cleaning steps, saving time and resources.
How to Use MG Chemicals SAC305 Lead-Free No Clean Solder
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Preparation:
- Ensure the components and surfaces to be soldered are clean and free from oxidation or contaminants.
- Use isopropyl alcohol and a lint-free cloth to clean the surfaces if necessary.
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Heating:
- Preheat your soldering iron to a temperature suitable for lead-free solder, typically around 350°C (662°F).
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Soldering:
- Touch the soldering iron tip to both the component lead and the PCB pad to heat them.
- Apply the solder wire to the joint, not the iron, to allow it to flow and form a good connection.
- Remove the solder wire and then the iron once the solder has flowed sufficiently.
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Inspection:
- Check the solder joint for a shiny, smooth appearance indicating a good connection.
- If necessary, reheat and apply additional solder to ensure a solid joint.
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Completion:
- Allow the solder joint to cool naturally.
- Since the flux is no-clean, there is no need for post-soldering cleaning, simplifying the process.
Additional Information
Tri-Tek Electronics is an authorized distributor of MG Chemicals products, ensuring you receive full manufacturer warranty coverage and the best pricing and factory support.
