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Silicone Heat Transfer Compound - 150g Tube

MG 860-150G: Silicone Heat Transfer Compound

The MG Chemicals 860-150G is a high-performance silicone-based heat transfer compound designed for optimizing thermal conductivity between heat-generating components and their heat sinks or heat dissipation surfaces. This compound is formulated to improve heat transfer efficiency and is critical for ensuring the reliability and performance of electronic devices by maintaining optimal operating temperatures.

The 860-150G compound is non-curing and provides stable thermal conductivity across a wide temperature range. It is electrically insulating, which prevents short circuits and electrical failures, making it safe for use in a variety of electronic applications. This heat transfer compound is ideal for use in electronic assemblies, power supplies, and other high-power components requiring efficient thermal management.

Features

  • Excellent Thermal Conductivity: Enhances heat transfer between components and heat sinks, with a thermal conductivity of 0.9 W/m·K.
  • Stable Across Temperature Ranges: Remains effective across a wide operating temperature range from -50°C to 200°C (-58°F to 392°F).
  • Non-Curing: Maintains its consistency over time, allowing for easy rework and maintenance.
  • Electrical Insulation: Provides high dielectric strength, preventing electrical failures and short circuits.
  • Low Thermal Resistance: Reduces thermal resistance to ensure efficient heat dissipation.
  • Easy Application: Smooth paste consistency allows for easy application and spread.
  • RoHS Compliant: Meets environmental safety standards, free from hazardous substances.

Specifications

  • Part Number: 860-150G
  • Weight: 150 g (5.29 oz)
  • Color: White
  • Viscosity: Paste
  • Thermal Conductivity: 0.9 W/m·K
  • Operating Temperature Range: -50°C to 200°C (-58°F to 392°F)
  • Dielectric Strength: 18 kV/mm
  • Specific Gravity: 2.3
  • Volume Resistivity: 10¹⁴ Ω·cm
  • Country of Origin: Canada
  • Shelf Life: 5 years from the date of manufacture

Applications

The MG 860-150G Silicone Heat Transfer Compound is ideal for a variety of thermal management applications, including:

  • Electronics Assembly: Enhances heat dissipation in processors, ICs, and other electronic components.
  • Power Supplies: Improves heat transfer in high-power transistors and other heat-sensitive components.
  • LED Lighting: Ensures efficient cooling of LEDs, extending their lifespan and performance.
  • Automotive Electronics: Used in electronic control units and sensors to manage heat dissipation.
  • Industrial Equipment: Aids in the thermal management of machinery and power electronics.
  • Computer Systems: Enhances cooling in CPUs, GPUs, and other high-heat components.

Example Use Scenario

For a computer technician, the MG 860-150G Silicone Heat Transfer Compound is essential when assembling or upgrading computer systems. When applying a new heat sink to a CPU, the technician spreads a thin layer of the compound on the CPU surface to fill in microscopic gaps and ensure maximum contact between the CPU and the heat sink. This promotes efficient heat transfer, preventing overheating and ensuring the system runs smoothly and reliably.

How to Use

  1. Surface Preparation: Clean the surfaces to be joined to remove any dust, dirt, or old thermal compound residues.
  2. Apply Compound: Apply a small amount of MG 860-150G compound to the center of the heat-generating component.
  3. Spread Evenly: Spread the compound evenly across the surface using a spatula or straight edge to ensure a thin, uniform layer.
  4. Install Heat Sink: Carefully place the heat sink onto the component, ensuring good contact and even pressure distribution.
  5. Secure in Place: Tighten any mounting hardware to secure the heat sink in place, ensuring that it remains in contact with the thermal compound.
  6. Inspect: Check the installation to ensure there is no excess compound oozing out, which could potentially lead to short circuits.

Authorized Distributor

Tri-Tek Electronics is an authorized distributor of MG Chemicals products, including the MG 860-150G Silicone Heat Transfer Compound. We offer full manufacturer warranty coverage, competitive pricing, and expert factory support for all MG Chemicals products.

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MG 860-150G: Silicone Heat Transfer Compound The MG Chemicals 860-150G is a high-performance silicone-based heat transfer compound designed for optimizing... Read more

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SKU: MG860-150G
UPC: 0779008860151

2 in stock

$24.65 $19.68

      MG 860-150G: Silicone Heat Transfer Compound

      The MG Chemicals 860-150G is a high-performance silicone-based heat transfer compound designed for optimizing thermal conductivity between heat-generating components and their heat sinks or heat dissipation surfaces. This compound is formulated to improve heat transfer efficiency and is critical for ensuring the reliability and performance of electronic devices by maintaining optimal operating temperatures.

      The 860-150G compound is non-curing and provides stable thermal conductivity across a wide temperature range. It is electrically insulating, which prevents short circuits and electrical failures, making it safe for use in a variety of electronic applications. This heat transfer compound is ideal for use in electronic assemblies, power supplies, and other high-power components requiring efficient thermal management.

      Features

      • Excellent Thermal Conductivity: Enhances heat transfer between components and heat sinks, with a thermal conductivity of 0.9 W/m·K.
      • Stable Across Temperature Ranges: Remains effective across a wide operating temperature range from -50°C to 200°C (-58°F to 392°F).
      • Non-Curing: Maintains its consistency over time, allowing for easy rework and maintenance.
      • Electrical Insulation: Provides high dielectric strength, preventing electrical failures and short circuits.
      • Low Thermal Resistance: Reduces thermal resistance to ensure efficient heat dissipation.
      • Easy Application: Smooth paste consistency allows for easy application and spread.
      • RoHS Compliant: Meets environmental safety standards, free from hazardous substances.

      Specifications

      • Part Number: 860-150G
      • Weight: 150 g (5.29 oz)
      • Color: White
      • Viscosity: Paste
      • Thermal Conductivity: 0.9 W/m·K
      • Operating Temperature Range: -50°C to 200°C (-58°F to 392°F)
      • Dielectric Strength: 18 kV/mm
      • Specific Gravity: 2.3
      • Volume Resistivity: 10¹⁴ Ω·cm
      • Country of Origin: Canada
      • Shelf Life: 5 years from the date of manufacture

      Applications

      The MG 860-150G Silicone Heat Transfer Compound is ideal for a variety of thermal management applications, including:

      • Electronics Assembly: Enhances heat dissipation in processors, ICs, and other electronic components.
      • Power Supplies: Improves heat transfer in high-power transistors and other heat-sensitive components.
      • LED Lighting: Ensures efficient cooling of LEDs, extending their lifespan and performance.
      • Automotive Electronics: Used in electronic control units and sensors to manage heat dissipation.
      • Industrial Equipment: Aids in the thermal management of machinery and power electronics.
      • Computer Systems: Enhances cooling in CPUs, GPUs, and other high-heat components.

      Example Use Scenario

      For a computer technician, the MG 860-150G Silicone Heat Transfer Compound is essential when assembling or upgrading computer systems. When applying a new heat sink to a CPU, the technician spreads a thin layer of the compound on the CPU surface to fill in microscopic gaps and ensure maximum contact between the CPU and the heat sink. This promotes efficient heat transfer, preventing overheating and ensuring the system runs smoothly and reliably.

      How to Use

      1. Surface Preparation: Clean the surfaces to be joined to remove any dust, dirt, or old thermal compound residues.
      2. Apply Compound: Apply a small amount of MG 860-150G compound to the center of the heat-generating component.
      3. Spread Evenly: Spread the compound evenly across the surface using a spatula or straight edge to ensure a thin, uniform layer.
      4. Install Heat Sink: Carefully place the heat sink onto the component, ensuring good contact and even pressure distribution.
      5. Secure in Place: Tighten any mounting hardware to secure the heat sink in place, ensuring that it remains in contact with the thermal compound.
      6. Inspect: Check the installation to ensure there is no excess compound oozing out, which could potentially lead to short circuits.

      Authorized Distributor

      Tri-Tek Electronics is an authorized distributor of MG Chemicals products, including the MG 860-150G Silicone Heat Transfer Compound. We offer full manufacturer warranty coverage, competitive pricing, and expert factory support for all MG Chemicals products.

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