Solder

MG 4860-18G: Sn63/Pb37 Solder Pocket Pack The MG Chemicals 4860-18G Sn63/Pb37 Solder is a high-quality, eutectic solder wire designed for precision electronics soldering. This solder is composed of 63% tin and 37% lead, which ensures a low melting point and excellent flow characteristics, making it ideal for a wide range of electronic applications. The eutectic composition allows the solder to transition directly from solid to liquid, eliminating the plastic phase and ensuring smooth, reliable solder joints. This solder wire is suitable for both professional electronics assembly and repair work, offering consistent performance and strong, durable solder joints. It is particularly valued for its ease of use and ability to create reliable connections in delicate and high-density electronic assemblies. Features Eutectic Alloy: Sn63/Pb37 composition with a melting point of 183°C (361.4°F). Excellent Wettability: Ensures strong, reliable solder joints with good flow characteristics. Fast-Flowing: Quickly melts and flows, reducing soldering time and improving efficiency. High Joint Reliability: Produces durable connections that withstand mechanical and thermal stress. Consistent Performance: Offers reliable results for both manual and automated soldering processes. RoHS Exempt: Suitable for applications where RoHS compliance is not required. Easy to Use: Smooth handling characteristics make it ideal for fine soldering work. Specifications Part Number: 4860-18G Weight: 18 g (0.63 oz) Alloy Composition: 63% Tin (Sn), 37% Lead (Pb) Melting Point: 183°C (361.4°F) Flux Core: Rosin activated flux (RMA) Diameter: 0.8 mm (0.031 in) Country of Origin: Canada Shelf Life: Indefinite under proper storage conditions Applications The MG 4860-18G Sn63/Pb37 Solder is ideal for a wide range of applications including: Electronics Assembly: Suitable for general electronics soldering tasks. PCB Repair: Ideal for repairing broken or damaged solder joints on printed circuit boards. Fine-Pitch Soldering: Perfect for soldering small, densely packed components. Automotive Electronics: Used for soldering connections in vehicle electronics. Prototyping and Small Batch Production: Suitable for creating prototypes and small-scale production runs. Hobbyist Projects: Great for electronics enthusiasts and DIY projects. Example Installation Scenario For an electronics technician, the MG 4860-18G Sn63/Pb37 Solder is essential when performing repairs on a PCB with fine-pitch components. The eutectic alloy's low melting point and excellent flow characteristics allow the technician to quickly and effectively create solid, reliable solder joints without the risk of overheating sensitive components. This is particularly important in applications where precise, high-quality soldering is required to ensure the longevity and reliability of the electronics. How to Use Preparation: Clean the surfaces to be soldered to remove any contaminants. Heat the Joint: Use a soldering iron to heat the joint until the soldering temperature is reached. Apply Solder: Touch the MG 4860-18G Sn63/Pb37 solder to the heated joint, allowing it to flow and form a strong bond. Remove Heat: Once the solder flows and forms a smooth joint, remove the heat and allow the solder to cool and solidify. Inspect Joint: Check the joint for any imperfections or cold solder joints and rework if necessary. Authorized Distributor Tri-Tek Electronics is an authorized distributor of MG Chemicals products, including the MG 4860-18G Sn63/Pb37 Solder. We provide full manufacturer warranty coverage, competitive pricing, and expert factory support for all MG Chemicals products.

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MG 4885-454G: Rosin Core Solder Wire The MG Chemicals 4885-454G is a high-performance rosin core solder wire designed for precision soldering in electronics applications. This solder is composed of a tin-lead alloy with a core of rosin flux, which facilitates excellent wetting and solder joint reliability. The 4885-454G solder wire is ideal for use in both manufacturing and repair of electronic circuits, providing strong, conductive connections that withstand thermal and mechanical stresses. The rosin core in this solder wire provides effective fluxing action that cleans the metal surfaces during soldering, ensuring good adhesion and minimizing the risk of defects such as cold solder joints. This makes it a preferred choice for a wide range of electronics soldering applications. Features Rosin Core Flux: Contains a rosin-based flux that promotes excellent wetting and strong, reliable solder joints. Eutectic Alloy: Composed of tin and lead in a 63/37 ratio, with a melting point of 183°C (361.4°F). Smooth Flow: Flows easily and evenly, reducing the risk of bridging and other soldering defects. Strong Joint Formation: Provides durable solder joints that can withstand mechanical and thermal stress. Minimal Residue: Leaves a non-corrosive, minimal residue that usually does not require cleaning. RoHS Exempt: Suitable for applications where RoHS compliance is not required. Specifications Part Number: 4885-454G Weight: 454 g (1 lb) Alloy Composition: 63% Tin (Sn), 37% Lead (Pb) Flux Type: Rosin core (RMA - Rosin Mildly Activated) Flux Content: 2.5% Wire Diameter: 1.0 mm (0.039 in) Melting Point: 183°C (361.4°F) Country of Origin: Canada Shelf Life: Indefinite under proper storage conditions Applications The MG 4885-454G Rosin Core Solder Wire is ideal for a wide range of applications including: Electronics Assembly: Suitable for soldering components in electronics manufacturing. PCB Repair: Ideal for repairing and reworking solder joints on printed circuit boards. Hobbyist and DIY Projects: Perfect for electronics enthusiasts and small-scale soldering projects. Automotive Electronics: Used for soldering connections in vehicle electronic systems. Prototyping: Excellent for creating prototypes and small batch production runs. General Purpose Soldering: Suitable for various general electronics soldering tasks. Example Installation Scenario For an electronics technician working on the assembly line of consumer electronics, the MG 4885-454G is crucial for creating reliable solder joints in small and delicate components on a PCB. The rosin core flux helps ensure good wetting and strong adhesion to the metal surfaces, forming durable connections that are essential for the product's long-term reliability. This solder wire is particularly useful for fine-pitch components and densely packed boards where precision and consistency are key. How to Use Surface Preparation: Clean the surfaces to be soldered to remove any contaminants. Heat the Joint: Use a soldering iron to heat the joint to the appropriate temperature. Apply Solder: Touch the MG 4885-454G solder wire to the heated joint, allowing it to melt and flow. Remove Heat: Once the solder flows smoothly and covers the joint, remove the soldering iron and allow the solder to cool and solidify. Inspect Joint: Check the joint for a shiny, smooth finish, and ensure no defects are present. Authorized Distributor Tri-Tek Electronics is an authorized distributor of MG Chemicals products, including the MG 4885-454G Rosin Core Solder Wire. We provide full manufacturer warranty coverage, competitive pricing, and expert factory support for all MG Chemicals products.

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