MG Chemicals 4900-18G SAC305 Lead-Free No Clean Solder Pocket Pack, 2-pack
The MG Chemicals SAC305 Lead-Free No Clean Solder Pocket Pack is designed for convenient, high-performance soldering in both professional and DIY electronic applications. This solder wire is made from a SAC305 alloy (96.5% tin, 3% silver, 0.5% copper) and comes in a handy 2-pack for easy portability. The no-clean flux core ensures reliable solder joints without the need for post-soldering cleaning.
Features
Lead-Free Composition: Complies with RoHS directives, safe for both users and the environment.
High Performance: SAC305 alloy provides excellent wetting and soldering properties.
No Clean Flux Core: Leaves minimal residues, eliminating the need for post-soldering cleaning.
Convenient Packaging: Pocket-sized pack is ideal for field repairs and on-the-go soldering tasks.
Reliable and Strong Joints: Ensures high-quality, durable connections for electronic components.
Specifications
Alloy Composition: 96.5% tin, 3% silver, 0.5% copper (SAC305)
Flux Type: No clean
Wire Diameter: 0.81 mm (0.032 in)
Melting Point: 217°C (423°F)
Volume: 2-pack
Compliance: RoHS compliant
Example Use Scenario
The MG Chemicals SAC305 Lead-Free No Clean Solder Pocket Pack is perfect for field technicians who need a reliable soldering solution on the go. For instance, when performing repairs on a remote site, the pocket pack allows technicians to quickly and efficiently solder electronic components without needing to carry bulky equipment. The no-clean flux ensures that the job can be completed without requiring additional cleaning steps, saving time and resources.
How to Use MG Chemicals SAC305 Lead-Free No Clean Solder
Preparation:
Ensure the components and surfaces to be soldered are clean and free from oxidation or contaminants.
Use isopropyl alcohol and a lint-free cloth to clean the surfaces if necessary.
Heating:
Preheat your soldering iron to a temperature suitable for lead-free solder, typically around 350°C (662°F).
Soldering:
Touch the soldering iron tip to both the component lead and the PCB pad to heat them.
Apply the solder wire to the joint, not the iron, to allow it to flow and form a good connection.
Remove the solder wire and then the iron once the solder has flowed sufficiently.
Inspection:
Check the solder joint for a shiny, smooth appearance indicating a good connection.
If necessary, reheat and apply additional solder to ensure a solid joint.
Completion:
Allow the solder joint to cool naturally.
Since the flux is no-clean, there is no need for post-soldering cleaning, simplifying the process.
Additional Information
Tri-Tek Electronics is an authorized distributor of MG Chemicals products, ensuring you receive full manufacturer warranty coverage and the best pricing and factory support.
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