Thermal Management

NTE 303, Silicone Thermal 1 Gram Heat Sink Tube, 5pk A non-reactive, silicone, thermally conductive grease with a high thermal conductivity and low thermal resistance with a soft, non-flowable consistency. Re-workable, easy to remove.  

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NTE 303A Silicone Thermal Compound 1oz Plunger Tube Ensure optimal performance and reliability with the NTE 303A Silicone Thermal Compound. Designed for professionals in electronics, IT, and low voltage installations, this product offers exceptional value and efficiency. **Features:** - 1 Ounce Tube - Temperature Range: -40 to +400 Deg Fahrenheit - Easy-to-use Plunger Tube for precise application - High thermal conductivity for improved heat dissipation - Closeout Special: Limited stock available at a discounted price **Specifications:** - Product: Silicone Thermal Compound 1oz Plunger Tube - Brand: NTE - Weight: 1oz - Temperature Range: -40 to +400 Deg Fahrenheit **Benefits:** - Ensures optimal performance of electronic components - Facilitates heat dissipation for enhanced efficiency - Trusted quality from NTE, a leading manufacturer in the industry - Available exclusively through Tri-Tek Electronics, an authorized distributor Upgrade your installations with the NTE 303A Silicone Thermal Compound and experience the difference. Act fast to secure this closeout special while stocks last!

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NTE 424 Non-Silicone Heat Sink Compound - High thermal conductivity for efficient heat transfer - Non-migrating material with low bleed - Poly synthetic based for long-lasting performance - Non-toxic and high dielectric strength 🔧 Specifications: - Specific Gravity: 2.7 - Vapor Pressure: <1 - Flash Point: >400°F 🛠️ Applications: - Ideal for industrial use - Perfect for electronics technicians, IT professionals, and low voltage installers Tri-Tek Electronics is proud to be an authorized distributor of this premium product, ensuring quality and authenticity. Hurry, this closeout special won't last long! Order now while stock lasts!

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MG Chemicals 8618-10ML High-Performance Ultra Thermal Paste 6 W/(m·K) - 10ml Syringe Product Overview The MG Chemicals 8618-10ML High-Performance Ultra Thermal Paste is engineered to deliver superior thermal conductivity, making it an excellent choice for electronics, computer components, and other applications requiring efficient heat dissipation. With a thermal conductivity rating of 6 W/(m·K), this paste ensures optimal performance for high-power devices. Features High Thermal Conductivity: 6 W/(m·K) ensures excellent heat transfer. Low Thermal Resistance: Enhances the efficiency of heat dissipation. Non-Electrically Conductive: Safe to use in electronic components without risk of short-circuits. Stability and Reliability: Maintains performance over a wide range of temperatures and conditions. Easy Application: Comes in a 10ml syringe for precise application. Specifications Thermal Conductivity: 6 W/(m·K) Color: White Density: 2.6 g/cm³ Operating Temperature Range: -50°C to 200°C (-58°F to 392°F) Volume: 10ml syringe Application: Ideal for use in CPUs, GPUs, LEDs, power transistors, and other heat-sensitive components. Example Installation Scenario When assembling a high-performance gaming PC, applying MG Chemicals 8618-3ML Ultra Thermal Paste between the CPU and its cooler significantly enhances thermal conductivity, ensuring efficient heat transfer and maintaining optimal operating temperatures. This thermal paste is also ideal for use in other critical applications such as heat sinks for LED lighting and power transistors, where reliable thermal management is crucial for performance and longevity. How to Use MG Chemicals 8618-10ML Thermal Paste Preparation: Ensure both surfaces (e.g., CPU and heat sink) are clean and free of old thermal paste or debris. Use isopropyl alcohol and a lint-free cloth to clean the surfaces thoroughly. Application: Remove the cap from the 10ml syringe. Apply a small amount of thermal paste (about the size of a pea or a grain of rice) to the center of the CPU. Spreading: If preferred, use a flat-edged tool or a plastic card to spread the paste evenly across the CPU surface. This step is optional as the pressure from the heat sink will spread the paste evenly. Mounting the Heat Sink: Carefully place the heat sink on top of the CPU. Press down gently and evenly to spread the thermal paste. Secure the heat sink according to the manufacturer’s instructions, ensuring even pressure. Final Check: Ensure the heat sink is firmly in place and there are no gaps. Reassemble your system and power it on to check for proper thermal performance. Additional Information Tri-Tek Electronics is an authorized distributor of MG Chemicals products, ensuring you receive full manufacturer warranty coverage and the best pricing and factory support.

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MG Chemicals 8618-3ML High-Performance Ultra Thermal Paste 6 W/(m·K) - 3ml Syringe Product Overview The MG Chemicals 8618-3ML High-Performance Ultra Thermal Paste is engineered to deliver superior thermal conductivity, making it an excellent choice for electronics, computer components, and other applications requiring efficient heat dissipation. With a thermal conductivity rating of 6 W/(m·K), this paste ensures optimal performance for high-power devices. Features High Thermal Conductivity: 6 W/(m·K) ensures excellent heat transfer. Low Thermal Resistance: Enhances the efficiency of heat dissipation. Non-Electrically Conductive: Safe to use in electronic components without risk of short-circuits. Stability and Reliability: Maintains performance over a wide range of temperatures and conditions. Easy Application: Comes in a 3ml syringe for precise application. Specifications Thermal Conductivity: 6 W/(m·K) Color: White Density: 2.6 g/cm³ Operating Temperature Range: -50°C to 200°C (-58°F to 392°F) Volume: 3ml syringe Application: Ideal for use in CPUs, GPUs, LEDs, power transistors, and other heat-sensitive components. Example Installation Scenario When assembling a high-performance gaming PC, applying MG Chemicals 8618-3ML Ultra Thermal Paste between the CPU and its cooler significantly enhances thermal conductivity, ensuring efficient heat transfer and maintaining optimal operating temperatures. This thermal paste is also ideal for use in other critical applications such as heat sinks for LED lighting and power transistors, where reliable thermal management is crucial for performance and longevity. How to Use MG Chemicals 8618-3ML Thermal Paste Preparation: Ensure both surfaces (e.g., CPU and heat sink) are clean and free of old thermal paste or debris. Use isopropyl alcohol and a lint-free cloth to clean the surfaces thoroughly. Application: Remove the cap from the 3ml syringe. Apply a small amount of thermal paste (about the size of a pea or a grain of rice) to the center of the CPU. Spreading: If preferred, use a flat-edged tool or a plastic card to spread the paste evenly across the CPU surface. This step is optional as the pressure from the heat sink will spread the paste evenly. Mounting the Heat Sink: Carefully place the heat sink on top of the CPU. Press down gently and evenly to spread the thermal paste. Secure the heat sink according to the manufacturer’s instructions, ensuring even pressure. Final Check: Ensure the heat sink is firmly in place and there are no gaps. Reassemble your system and power it on to check for proper thermal performance. Additional Information Tri-Tek Electronics is an authorized distributor of MG Chemicals products, ensuring you receive full manufacturer warranty coverage and the best pricing and factory support.

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MG Chemicals 8617A-10ML Premium Thermal Paste - 3 W/(m·K) 10ml Syringe The MG Chemicals 8617A-10ML Premium Thermal Paste is designed to provide reliable thermal conductivity, ensuring efficient heat transfer for electronic components. With a thermal conductivity rating of 3 W/(m·K), this thermal paste is ideal for various applications, including CPUs, GPUs, and other heat-sensitive devices. Features Moderate Thermal Conductivity: 3 W/(m·K) for effective heat dissipation. Low Thermal Resistance: Ensures efficient heat transfer. Non-Electrically Conductive: Safe for use with electronic components without risk of short-circuits. Stable and Reliable: Maintains performance across a wide range of temperatures and conditions. Convenient Application: Provided in a 10ml syringe for precise and easy application. Specifications Thermal Conductivity: 3 W/(m·K) Color: White Density: 2.5 g/cm³ Operating Temperature Range: -50°C to 200°C (-58°F to 392°F) Volume: 10ml syringe Application: Suitable for CPUs, GPUs, LEDs, power transistors, and other heat-sensitive components. Example Use Scenario When upgrading a computer’s cooling system, applying MG Chemicals 8617A-10ML Premium Thermal Paste between the CPU and its cooler can significantly improve thermal performance. This paste is also well-suited for use in LED lighting systems and power transistors, providing reliable heat management to ensure optimal operation and longevity of components. How to Use MG Chemicals 8617A-10ML Thermal Paste Preparation: Clean both surfaces (e.g., CPU and heat sink) to remove old thermal paste and debris using isopropyl alcohol and a lint-free cloth. Application: Remove the cap from the 10ml syringe. Apply a small amount of thermal paste (approximately the size of a pea or a grain of rice) to the center of the CPU. Spreading: Optionally, use a flat-edged tool or a plastic card to spread the paste evenly across the CPU surface. This is not mandatory as the heat sink’s pressure will spread the paste. Mounting the Heat Sink: Place the heat sink on top of the CPU carefully. Press down gently and evenly to spread the thermal paste. Secure the heat sink according to the manufacturer's instructions to ensure even pressure. Final Check: Ensure the heat sink is properly mounted with no gaps. Reassemble the system and power it on to verify effective thermal performance. Additional Information Tri-Tek Electronics is an authorized distributor of MG Chemicals products, ensuring you receive full manufacturer warranty coverage and the best pricing and factory support.

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MG 860-150G: Silicone Heat Transfer Compound The MG Chemicals 860-150G is a high-performance silicone-based heat transfer compound designed for optimizing thermal conductivity between heat-generating components and their heat sinks or heat dissipation surfaces. This compound is formulated to improve heat transfer efficiency and is critical for ensuring the reliability and performance of electronic devices by maintaining optimal operating temperatures. The 860-150G compound is non-curing and provides stable thermal conductivity across a wide temperature range. It is electrically insulating, which prevents short circuits and electrical failures, making it safe for use in a variety of electronic applications. This heat transfer compound is ideal for use in electronic assemblies, power supplies, and other high-power components requiring efficient thermal management. Features Excellent Thermal Conductivity: Enhances heat transfer between components and heat sinks, with a thermal conductivity of 0.9 W/m·K. Stable Across Temperature Ranges: Remains effective across a wide operating temperature range from -50°C to 200°C (-58°F to 392°F). Non-Curing: Maintains its consistency over time, allowing for easy rework and maintenance. Electrical Insulation: Provides high dielectric strength, preventing electrical failures and short circuits. Low Thermal Resistance: Reduces thermal resistance to ensure efficient heat dissipation. Easy Application: Smooth paste consistency allows for easy application and spread. RoHS Compliant: Meets environmental safety standards, free from hazardous substances. Specifications Part Number: 860-150G Weight: 150 g (5.29 oz) Color: White Viscosity: Paste Thermal Conductivity: 0.9 W/m·K Operating Temperature Range: -50°C to 200°C (-58°F to 392°F) Dielectric Strength: 18 kV/mm Specific Gravity: 2.3 Volume Resistivity: 10¹⁴ Ω·cm Country of Origin: Canada Shelf Life: 5 years from the date of manufacture Applications The MG 860-150G Silicone Heat Transfer Compound is ideal for a variety of thermal management applications, including: Electronics Assembly: Enhances heat dissipation in processors, ICs, and other electronic components. Power Supplies: Improves heat transfer in high-power transistors and other heat-sensitive components. LED Lighting: Ensures efficient cooling of LEDs, extending their lifespan and performance. Automotive Electronics: Used in electronic control units and sensors to manage heat dissipation. Industrial Equipment: Aids in the thermal management of machinery and power electronics. Computer Systems: Enhances cooling in CPUs, GPUs, and other high-heat components. Example Use Scenario For a computer technician, the MG 860-150G Silicone Heat Transfer Compound is essential when assembling or upgrading computer systems. When applying a new heat sink to a CPU, the technician spreads a thin layer of the compound on the CPU surface to fill in microscopic gaps and ensure maximum contact between the CPU and the heat sink. This promotes efficient heat transfer, preventing overheating and ensuring the system runs smoothly and reliably. How to Use Surface Preparation: Clean the surfaces to be joined to remove any dust, dirt, or old thermal compound residues. Apply Compound: Apply a small amount of MG 860-150G compound to the center of the heat-generating component. Spread Evenly: Spread the compound evenly across the surface using a spatula or straight edge to ensure a thin, uniform layer. Install Heat Sink: Carefully place the heat sink onto the component, ensuring good contact and even pressure distribution. Secure in Place: Tighten any mounting hardware to secure the heat sink in place, ensuring that it remains in contact with the thermal compound. Inspect: Check the installation to ensure there is no excess compound oozing out, which could potentially lead to short circuits. Authorized Distributor Tri-Tek Electronics is an authorized distributor of MG Chemicals products, including the MG 860-150G Silicone Heat Transfer Compound. We offer full manufacturer warranty coverage, competitive pricing, and expert factory support for all MG Chemicals products.

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